Semiconductor Packaging Material Market Growth Rate, Trends, Analysis, Future scope, Size, Share, Forecast to 2023
Global Semiconductor Packaging Material Market report: by type (organic substrates,
bonding wires, encapsulation resins, ceramic packages, solder balls, wafer
level packaging dielectrics and others), technology (grid array, small outline
package, dual flat no-leads, quad flat package, dual in-line package and
others), and region - Global Forecast to 2023
Market Scenario
Semiconductor packaging materials are used in the final stage of
semiconductor device fabrication and are used to safeguard devices from
deterioration and external influence. The global semiconductor packaging
material has perceived a noteworthy growth over the past few years owing to the
growing demand for mobile phones, tablets, and
other communication devices. Furthermore, the market is projected to keep on
increasing during the forecast period 2017-2023. The semiconductor packaging
materials are major platform to the
success of the semiconductor business
across the sphere, and the shifting of
the customer towards modern electronics
are propelling the semiconductor packaging material market. The vital factor
driving the market is the continuously growing mobile industry and
technological advancements. Moreover, the increased demand for mobile and
communication devices have further augmented the semiconductor packaging
material market.
The increasing implementation of integrated circuits in various
electronic devices is prompting the demand for semiconductor packaging
material. Different types of material are used for the semiconductor packaging
including organic substrates, bonding wires, encapsulation resins, ceramic
packages, solder balls, wafer level packaging dielectrics, and others. Rapid
advancements in the technology are benefitting superior acceptance of these
packaging materials.
Increasing miniaturization of the electronic devices across the
world is one of the major driver of the market. Additionally, Consumer’s
preferences across the world gaining popularity over portable and cost-effective devices. Thus, the major
manufacturers are concentrating on creating a compact and lightweight
electronic device to maintain the key position in the market. Innovative packaging technologies such as SiP, flip-chip,
and WLP are expected to drive the expansion of new materials solutions. This technology ensures the high density and
improved performance of the materials in miniaturized packages. Furthermore,
the increasing demand for compact devices across various sectors such as automotive industry, telecommunication, and electronic industry will also play a vital
role in boosting the market growth during the forecast period. The Asia Pacific
market is native to the major electronic manufacturing giants in economies such
as China, Japan, South Korea, and Taiwan. The market is projected to practice
vigorous growth due to augmented demand for smart devices and additional
electronic goods over the forecast period.
Global semiconductor packaging material market is segmented based on
type, technology, and region. Based on the type,
the market is segmented into organic substrates, bonding wires,
encapsulation resins, ceramic packages, solder balls, wafer level packaging
dielectrics, and others. Among these, the
organic substrates are projected to dominate the semiconductor
packaging material market over the review period 2017-2023 because these
materials form the base layers of single semiconductor devices and chips on
which additional layers are dumped to complete the circuit. They are progressively favored over other
resources like lead frames as the industry is diminishing the use of lead. Based on the technology, the market is segmented into
grid array, small outline package, dual flat no-leads, quad flat package, dual
in-line package, and others. Grid array dominated
the market in 2016 and is projected to be the fastest-growing technology. The
wide application of grid array across all major semiconductor packaging type is
creating a fruitful semiconductor
packaging material market across the globe.
The semiconductor packaging material industry is extremely
fragmented with a number of multinational, local, and regional players. The
Asia Pacific manufacturers are holding the dominant position in the market.
Local players are levitating the stakes by catering
innovative offerings at lower
prices than the international vendors. The market is also expected to have high
expansion activities by multinationals and well-established companies.
The global Semiconductor Packaging Material Market is expected to
grow at a CAGR of 5% during the forecast period.
Global Semiconductor Packaging
Material Market
The unremitting research and development
exertions by major players in making the electronic packaging materials
extremely dependable to intensify the growth of the global semiconductor
packaging materials. The increasing demand for consumer electronics is
supplementing the market growth. The rising consciousness about the
practicality of electronic packaging materials in numerous applications is also
contributing a significant boost to the growth of the market. However, fluctuating
prices of the raw materials are upsetting the growth of the market. On the
basis of the region, the global semiconductor packaging material market is
segmented into North America, Asia Pacific, Europe, and Rest of the World. The Asia Pacific currently holds the pole position in the semiconductor packaging material
market owing to fast technological growths and the developing demand for
progressive electronic packaging materials from the end-users. Furthermore, the
large investments in electronics
applications along with low-cost manufacturing, low workforce cost, and easy convenience
of the raw materials are subsidizing to
the evolution of the region.
Key Players
The key players in the global semiconductor packaging material market
are Henkel AG & Company, KGaA (Germany), Hitachi Chemical Company, Ltd. (Japan), Sumitomo Chemical Co.,
Ltd. (Japan), Kyocera Chemical Corporation (Japan), Mitsui High-tec, Inc.
(Japan), Toray Industries, Inc. (Japan), Alent plc (U.K.), LG Chem (South
Korea), BASF SE (Germany), Tanaka Kikinzoku Group (Japan), E. I. du Pont de
Nemours and Company (U.S.), Honeywell International Inc. (U.S.), Toppan
Printing Co., Ltd. (Japan), Nippon Micrometal Corporation (Japan), and Alpha Advanced Materials (U.S.)
Access Full Report
@ https://www.marketresearchfuture.com/reports/semiconductor-packaging-material-market-1217
DC
·
ic package
·
semiconductor
packaging
·
cosmetic
packaging
·
vacuum
packaging
·
packaging
supplies
·
packaging
materials
·
packaging
companies
·
silicon
wafer
·
semiconductor
packaging materials
·
protective
packaging
·
ceramic
packages for semiconductors
·
semiconductor
assembly
·
lattice
semiconductor
·
semiconductor
companies
Comments
Post a Comment