Global Semiconductor Packaging Material Market Developments and Forecast to 2023
Market
Scenario
Semiconductor
Packaging Materials are used in the final stage of semiconductor device fabrication and are
used to safeguard devices from deterioration and external influence. The global
semiconductor packaging material has perceived a noteworthy growth over the
past few years owing to the growing demand for mobile phones, tablets, and
other communication devices. Furthermore, the market is projected to keep on
increasing during the forecast period 2017-2023. The semiconductor packaging
materials are major platform to the success of the semiconductor business
across the sphere, and the shifting of the customer towards modern electronics
are propelling the semiconductor packaging material market. The vital factor
driving the market is the continuously growing mobile industry and technological
advancements. Moreover, the increased demand for mobile and communication
devices have further augmented the semiconductor packaging material market.
The
increasing implementation of integrated circuits in various electronic devices
is prompting the demand for semiconductor packaging material. Different types
of material are used for the semiconductor packaging including organic
substrates, bonding wires, encapsulation resins, ceramic packages, solder
balls, wafer level packaging dielectrics, and others. Rapid advancements in the
technology are benefitting superior acceptance of these packaging materials.
Increasing
miniaturization of the electronic devices across the world is one of the major
driver of the market. Additionally, Consumer’s preferences across the world
gaining popularity over portable and cost-effective devices. Thus, the major
manufacturers are concentrating on creating a compact and lightweight
electronic device to maintain the key position in the market. Innovative
packaging technologies such as SiP, flip-chip, and WLP are expected to drive
the expansion of new materials solutions. This technology ensures the high
density and improved performance of the materials in miniaturized packages.
Furthermore, the increasing demand for compact devices across various sectors
such as automotive industry, telecommunication, and electronic industry will
also play a vital role in boosting the market growth during the forecast
period. The Asia Pacific market is native to the major electronic manufacturing
giants in economies such as China, Japan, South Korea, and Taiwan. The market
is projected to practice vigorous growth due to augmented demand for smart
devices and additional electronic goods over the forecast period.
Global
semiconductor packaging material market is segmented based on type, technology,
and region. Based on the type, the market is segmented into organic substrates,
bonding wires, encapsulation resins, ceramic packages, solder balls, wafer
level packaging dielectrics, and others. Among these, the organic substrates
are projected to dominate the semiconductor packaging material market over the
review period 2017-2023 because these materials form the base layers of single
semiconductor devices and chips on which additional layers are dumped to
complete the circuit. They are progressively favored over other resources like
lead frames as the industry is diminishing the use of lead. Based on the
technology, the market is segmented into grid array, small outline package,
dual flat no-leads, quad flat package, dual in-line package, and others. Grid
array dominated the market in 2016 and is projected to be the fastest-growing
technology. The wide application of grid array across all major semiconductor
packaging type is creating a fruitful semiconductor packaging material market
across the globe.
The
semiconductor packaging material industry is extremely fragmented with a number
of multinational, local, and regional players. The Asia Pacific manufacturers
are holding the dominant position in the market. Local players are levitating
the stakes by catering innovative offerings at lower prices than the
international vendors. The market is also expected to have high expansion
activities by multinationals and well-established companies.
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The global
semiconductor packaging material market is expected to grow at a CAGR of 5%
during the forecast period.
Key Players
The key
players in the global semiconductor packaging material market are Henkel AG
& Company, KGaA (Germany), Hitachi Chemical Company, Ltd. (Japan), Sumitomo
Chemical Co., Ltd. (Japan), Kyocera Chemical Corporation (Japan), Mitsui
High-tec, Inc. (Japan), Toray Industries, Inc. (Japan), Alent plc (U.K.), LG
Chem (South Korea), BASF SE (Germany), Tanaka Kikinzoku Group (Japan), E. I. du
Pont de Nemours and Company (U.S.), Honeywell International Inc. (U.S.), Toppan
Printing Co., Ltd. (Japan), Nippon Micrometal Corporation (Japan), and
Alpha Advanced Materials (U.S.)
Market
Segmentation
Global Semiconductor Packaging Material Market
The
unremitting research and development exertions by major players in making the
electronic packaging materials extremely dependable to intensify the growth of
the global semiconductor packaging materials. The increasing demand for
consumer electronics is supplementing the market growth. The rising
consciousness about the practicality of electronic packaging materials in
numerous applications is also contributing a significant boost to the growth of
the market. However, fluctuating prices of the raw materials are upsetting the
growth of the market. On the basis of the region, the global semiconductor
packaging material market is segmented into North America, Asia Pacific,
Europe, and Rest of the World. The Asia Pacific currently holds the pole
position in the semiconductor packaging material market owing to fast
technological growths and the developing demand for progressive electronic
packaging materials from the end-users. Furthermore, the large investments in
electronics applications along with low-cost manufacturing, low workforce cost,
and easy convenience of the raw materials are subsidizing to the evolution of
the region.
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